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- Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
- Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
- Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
- Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
- Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
- High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
- Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore
- Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation
- Conductive Co-based metal organic framework nanostructures for excellent potassium- and lithium-ion storage: Kinetics and mechanism studies
- A Comprehensive Study on the Rejuvenation Efficiency of Compound Rejuvenators for the Characterization of the Bituminous Binder, Mortar, and Mixture
- High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
- Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste
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