Study on the controllability of the fabrication of single-crystal silicon nanopores/nanoslits with a fast-stop ionic current-monitored TSWE method

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Combined CNN and RNN Neural Networks for GPR Detection of Railway Subgrade Diseases

DaisyRec 2.0: Benchmarking Recommendation for Rigorous Evaluation

Reverse Recovery Optimization of Multiepi Superjunction MOSFET Based on Tunable Doping Profile

Selective Peroxygenase-Catalysed Oxidation of Toluene Derivates to Benzaldehydes

Building water quality deterioration during water supply restoration after interruption: Influences of premise plumbing configuration

Controllable Fabrication and Rectification of Bipolar Nanofluid Diodes in Funnel-Shaped Si₃N₄ Nanopores

Flow and Flourishing During the Pandemic: The Roles of Strengths Use and Playful Design

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Laser-Induced Graphene Formation on Chitosan Derivatives toward Ecofriendly Electronics

Rapid Fabrication of High-Performance Flexible Pressure Sensors Using Laser Pyrolysis Direct Writing

Water Adsorption in MOFs: Structures and Applications

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging

Advanced controls on energy reliability, flexibility and occupant-centric control for smart and energy-efficient buildings