Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method

The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...

Accurate Feeding of Nanoantenna by Singular Optics for Nanoscale Translational and Rotational Displacement Sensing

Identifying subwavelength objects and displacements is of crucial importance in optical nanometrology. We show in this Letter that nanoantennas with subwavelength structures can be excited precisely by incident beams with singularity. This accurate feeding beyond the diffraction limit can lead to dynamic control of the unidirectional scattering...

Dynamic plasmonic beam shaping by vector beams with arbitrary locally linear polarization states

Vector beams, which have space-variant state of polarization (SOP) comparing with scalar beams with spatially homogeneous SOP, are used to manipulate surface plasmon polarizations (SPPs). We find that the excitation, orientation, and distribution of the focused SPPs excited in a high numerical aperture microscopic configuration highly depend on...