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Searched for: collection%253Air
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Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea
Revealing The Degradation Mechanism of (Sr,Ca)AlSiN
3
:Eu
2+
Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study
Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks
Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study
Warpage deformation analysis of AMB ceramic substrates in power modules
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Optimal Design of 100–2000 V 4H–SiC Power MOSFETs using Multi-objective Particle Swarm Optimization Algorithms
Optimizing the chemical vapor deposition process of 4H–SiC epitaxial layer growth with machine-learning-assisted multiphysics simulations
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
3.1 A 120.9dB DR, -111.2dB THD+N Digital-Input Capacitively-Coupled Chopper Class-D Audio Amplifier
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability
A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
Searched for: collection%253Air
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