Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

A bi-level framework for heterogeneous fleet sizing of ride-hailing services considering an approximated mixed equilibrium between automated and non-automated traffic

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Naturally effective inhibition of microbial corrosion on carbon steel by beneficial biofilm in the South China Sea

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks

Revealing The Degradation Mechanism of (Sr,Ca)AlSiN₃:Eu²⁺ Phosphor Aged Under Thermal-Moisture-Sulfur Conditions: A Combined Experimental and Ab Initio Study

HAS-RL: A Hierarchical Approximate Scheme Optimized With Reinforcement Learning for NoC-Based NN Accelerators

A Q-learning based multi-strategy integrated artificial bee colony algorithm with application in unmanned vehicle path planning

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Warpage deformation analysis of AMB ceramic substrates in power modules

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Reliability improvement of the dredging perception system: A sensor fault-tolerant strategy

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

23.3 A 51A Hybrid Magnetic Current Sensor with a Dual Differential DC Servo Loop and 43mA_rmsResolution in a 5MHz Bandwidth

3.1 A 120.9dB DR, -111.2dB THD+N Digital-Input Capacitively-Coupled Chopper Class-D Audio Amplifier

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation