Searched for: subject%253A%2522Dynamic%2522
(1 - 19 of 19)
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...
journal article 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...
conference paper 2024
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Xie, Weiming (author), Sun, J. (author), Guo, Leicheng (author), Xu, Fan (author), Wang, Xianye (author), Ji, Hongyu (author), Fan, Yaoshen (author), Wang, Zhengbing (author), He, Qing (author)
Coastal tidal flats provide valuable ecosystems, but are highly sensitive to tidal dynamics, sea-level rise, and human activities. Tidal inundation depth and frequency are known to affect tidal flat morphodynamics. However, the causes, processes and extent remain uncertain, particularly given the associated changes in sediment availability. In...
journal article 2023
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Shi, Can (author), Fan, Zheng (author), Connolly, David P. (author), Jing, Guoqing (author), Markine, V.L. (author), Guo, Y. (author)
Railway ballast performance is dictated by a complex mix of mechanical properties. These effect its performance at the particle level for example in terms of particle degradation, but also at the track system level in terms of settlement and stability. Therefore this paper seeks to develop new understandings of ballast behaviour and identify...
review 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)
Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...
journal article 2023
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Zhang, H. (author), Berkhout, M. (author), Makinwa, K.A.A. (author), Fan, Q. (author)
This article presents a digital-input class-D amplifier (CDA) achieving high dynamic range (DR) by employing a chopped capacitive feedback network and a capacitive digital-to-analog converter (DAC). Compared with conventional resistive-feedback CDAs driven by resistive or current-steering DACs, the proposed architecture eliminates the noise...
journal article 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...
conference paper 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)
This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based...
journal article 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
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Cui, Z. (author), Zhang, Y. (author), Hu, D. (author), Vollebregt, S. (author), Fan, J. (author), Fan, X. (author), Zhang, Kouchi (author)
Understanding the atomic diffusion features in metallic material is significant to explain the diffusion-controlled physical processes. In this paper, using electromigration experiments and molecular dynamic (MD) simulations, we investigate the effects of grain size and temperature on the self-diffusion of polycrystalline aluminium (Al). The...
journal article 2022
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Li, Shizhen (author), Liu, Yang (author), Ye, H. (author), Liu, X. (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)
This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...
journal article 2022
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...
journal article 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...
conference paper 2022
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Zhang, H. (author), Berkhout, Marco (author), Makinwa, K.A.A. (author), Fan, Q. (author)
This article presents a class-D amplifier (CDA) with high dynamic range (DR). To eliminate the typically dominant noise contribution of a resistive feedback network, the input and feedback signals are chopped and applied to a capacitive feedback network. However, this leads to high-voltage (HV) transients at the input of the loop filter,...
journal article 2022
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Fan, B. (author)
This thesis describes the experimental development of new dynamic hydrogels based on reversible thiol conjugate additions. Redox-controlled hydrogels and self-healing injectable hydrogels have been achieved by introducing reversible thiol conjugate additions to crosslink polymers, leading to hydrogel formation. The overall objective in this...
doctoral thesis 2021
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Hu, D. (author), Cui, Z. (author), Fan, J. (author), Fan, X. (author), Zhang, Kouchi (author)
A molecular dynamics (MD) simulation was performed on the coalescence kinetics and mechanical behavior of the pressure-assisted Cu nanoparticles (NPs) sintering at low temperature. To investigate the effects of sintering pressure and temperature on the coalescence of the nanoparticles, sintering simulations of two halve Cu NPs were conducted at...
journal article 2020
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Yalcin, A.O. (author), Fan, Z. (author), Goris, B. (author), Li, W.F. (author), Koster, R.S. (author), Fang, C.M. (author), Van Blaaderen, A. (author), Casavola, M. (author), Tichelaar, F.D. (author), Bals, S. (author), Van Tendeloo, G. (author), Vlugt, T.J.H. (author), Vanmaekelbergh, D. (author), Zandbergen, H.W. (author), Van Huis, M.A. (author)
Here, we show a novel solid?solid?vapor (SSV) growth mechanism whereby epitaxial growth of heterogeneous semiconductor nanowires takes place by evaporation-induced cation exchange. During heating of PbSe-CdSe nanodumbbells inside a transmission electron microscope (TEM), we observed that PbSe nanocrystals grew epitaxially at the expense of CdSe...
journal article 2014
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Fan, X. (author)
In a traditional AC distribution system, the synchronous frequencies of the generators are coupled with the system frequency, and thus the diesel engines are kept at a constant speed. In a Dynamic Positioning (DP) vessel such as a Platform Supply Vessel (PSV), the diesel engines sometimes work at the partial load condition. The efficiency of...
master thesis 2013
Searched for: subject%253A%2522Dynamic%2522
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