Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...

A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...

In-Situ Determination of Buildings’ Thermo-Physical Characteristics

Accurate determination of building’s critical thermo-physical characteristics such as the walls’ thermal resistance, thermal conductivity, and volumetric heat capacity is essential to indicate effective and efficient energy conservation strategies at building level. In practice, the values of these parameters, which determine not only possible...

In-situ rapid determination of walls’ thermal conductivity, volumetric heat capacity, and thermal resistance, using response factors

Accurate determination of walls' thermo-physical characteristics is a necessity for execution of energy conservation strategies in existing buildings. In practice, such data is not available because the current determination methods are time expensive and therefore rarely used. Based on the theory of Response Factors, a rapid transient in...

In-situ characterization of walls’ thermal resistance: An extension to the ISO 9869 standard method

Accurate and reliable in-situ characterization of buildings’ thermal envelope is of high significance to determine actual energy use and thermal comfort. In this context, walls’ thermal resistance is one of the most critical properties to be identified. Regardless the numerous studies being carried out to accurately measure the actual thermal...

A study on passive cooling in subsea power electronics

This paper proposes a simplified approach to model the thermal behavior of the insulated gate bipolar transistors (IGBTs) in a subsea power electronic converter. The models are based on empirical relations for natural convection in water, and IGBT datasheet values. The proposed model can be used in the design of subsea converters and in the...

Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...

Thermal Expansion and Aging Effects in Neuromorphic Signal Processor

In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more...

A Ratiometric Readout Circuit for Thermal-Conductivity-Based Resistive CO₂ Sensors

This paper reports a readout circuit for a resistive CO2 sensor, which operates by measuring the CO2-dependent thermal conductivity of air. A suspended hot-wire transducer, which acts both as a resistive heater and temperature sensor, exhibits a CO2-dependent heat loss to the surrounding air, allowing CO2 concentration to be derived from its...

Compact Modeling of Physical Mechanisms Present in the Weak Breakdown Regime of Advanced Si and SiGe Bipolar Transistors

With the current increasing demand for faster and more reliable communication and computing electronic devices such as faster wireless communication networks, circuit designers are forced to carry out device optimization in order to achieve the maximum possible performance. To enable full circuit optimization, designers depend on compact models...

Introduction to an in-situ method for rapid measurement of the walls’ thermal resistance in existing buildings

Large deviations observed between the actual and theoretical gas consumption in Dutch dwellings, cast a shadow of doubt on the accuracy of the energy labeling method. In this sense, the accuracy of the calculation methods as well as the inputs being fed, fall under the question. According to several studies, the significance of wall’s thermal...

The green building envelope: Vertical greening

Planting on roofs and façades is one of the most innovative and fastest developing fields of green technologies with respect to the built environment and horticulture. This thesis is focused on vertical greening of structures and to the multi-scale benefits of vegetation. Vertical green can improve the environment in urban areas and is becoming...

Resistances for heat and mass transfer through a liquid–vapor interface in a binary mixture

In this paper we calculate the interfacial resistances to heat and mass transfer through a liquid–vapor interface in a binary mixture. We use two methods, the direct calculation from the actual nonequilibrium solution and integral relations, derived earlier. We verify, that integral relations, being a relatively faster and cheaper method, indeed...

Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and A1N Cooling

This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission lines can be placed on the low-loss glass substrate, while the...

Characterization and AlN cooling of thermally isolated bipolar transistors

Nowadays, electrothermal effects (ET) are posing fundamental issues in nearly all branches of micro- and nano-electronics. Due to either a high power dissipation level or to the aggressive electrical isolation schemes adopted to increase the speed, both high and low power devices are affected by ET effects that limit their reliability and cause...

Thermal conductance measurement of honeycomb sandwich panels with carbon fibre reinforced plastic face sheets