Endoscopy is a medical procedure in which the inside of the body is looked into. Specifically, the gastrointestinal tract is of interest. This part of the body can be looked into with a swallowable wireless endoscopic pill. The pill contains different components such as different kinds of sensors, a microcontroller, a transmitter and the power supply. This thesis will discuss the power management of such a pill. The used parts are two CR1025 batteries at a voltage range of 4-6 V and capacity of 30 mAh, a TPS82150 switching converter at an efficiency of 85.8 % with an output voltage of 3.3 V, a TMP112B temperature sensor, a MS5534C pressure sensor and a CC2650 micro controller that consists of a main part (cpu), sensor controller part and a transmitter. The power used by the system was measured to be 2.74 mW per cycle. This resulted in a 57.69 hours runtime which leaves room for other sensors to be implemented and ensures a diagnosis of the whole gastrointestinal tract. All components have been put on a PCB and put into a 3D printed capsule of 123 mm in length and 33 mm in diameter.

Power electronics are an important technology used to convert electricity from a source like a battery or high voltage DC bus to more usable forms of electricity. This has to be done efficiently, reliably and without failures which is critical in applications like electric cars or datacenters. Power MOSFETs with upcoming SiC and GaN devices are an important building block used in these converters. Hence these power MOSFET devices have to be improved continuously to get a lower on resistance (RDSon), a better thermal dissipation and lower parasitic losses. In this thesis we will take a look at the embedding of power MOSFETs inside a PCB to obtain these improvements. This new technology needs to be evaluated in terms of reliability, failure-modes and thermal/electrical performance. By designing, manufacturing and testing a PCB with embedded devices. During manufacturing silver sintering has been used for attaching the die to a copper coin. In the end the manufacturing has been done successfully. Testing showed an 18% lower RDSon and a twice as low junction to ambient thermal impedance indicating a better performance compared to regular packaging.