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This work presents an experimental investigation of adhesive-based die attachment using the Drop-Attach technique, compared with the conventional pick-and-place method. Drop-Attach is a contactless process that eliminates the mechanical stresses inherent to force-assisted placement. In this method, dies are optically aligned and released—via a short air pulse—from a height of 100–300 μm above a substrate coated with a flat adhesive layer, enabling pressure-free, contactless placement. The process achieves smaller cycle times, potentially improving the throughput over conventional methods that require additional time for deceleration and bonding-force buildup. To assess feasibility and performance, a silver-filled bismaleimide/acrylate adhesive was printed on ENIG-finished pads, and dummy silicon dies with Au-, Ag-, and Cu-coated surfaces were assembled using both techniques. Bond quality was comprehensively analysed through measurements of bond line thickness, die tilt, void formation, die-shear strength, failure mechanisms, and electrical performance. Drop-Attach achieved minimal die tilt (≤0.1°) and uniform BLTs, though higher voiding and ∼9.55% increased electrical resistance were observed. The lower shear strength was primarily attributed to the absence of adhesive fillet formation rather than the lack of applied pressure. While trade-offs remain, this study demonstrates the feasibility of adhesive-based die attachment using the Drop-Attach method, which enables faster cycle times and higher throughput while significantly reducing mechanical stresses. These advantages position Drop-Attach as a promising technique for next-generation semiconductor packaging.
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This work presents an experimental investigation of adhesive-based die attachment using the Drop-Attach technique, compared with the conventional pick-and-place method. Drop-Attach is a contactless process that eliminates the mechanical stresses inherent to force-assisted placement. In this method, dies are optically aligned and released—via a short air pulse—from a height of 100–300 μm above a substrate coated with a flat adhesive layer, enabling pressure-free, contactless placement. The process achieves smaller cycle times, potentially improving the throughput over conventional methods that require additional time for deceleration and bonding-force buildup. To assess feasibility and performance, a silver-filled bismaleimide/acrylate adhesive was printed on ENIG-finished pads, and dummy silicon dies with Au-, Ag-, and Cu-coated surfaces were assembled using both techniques. Bond quality was comprehensively analysed through measurements of bond line thickness, die tilt, void formation, die-shear strength, failure mechanisms, and electrical performance. Drop-Attach achieved minimal die tilt (≤0.1°) and uniform BLTs, though higher voiding and ∼9.55% increased electrical resistance were observed. The lower shear strength was primarily attributed to the absence of adhesive fillet formation rather than the lack of applied pressure. While trade-offs remain, this study demonstrates the feasibility of adhesive-based die attachment using the Drop-Attach method, which enables faster cycle times and higher throughput while significantly reducing mechanical stresses. These advantages position Drop-Attach as a promising technique for next-generation semiconductor packaging.
It is estimated that 99 % of the world population is exposed to air pollution above air quality guidelines and this is responsible for 6.7 million premature deaths annually. Lung and skin are the first organs exposed to air pollution, and this is associated with carcinogenesis, inflammation and atopic disease. Proposed mechanisms of adverse health effects in lung and skin include oxidative stress, inflammation, and loss of epithelial barrier integrity. Most knowledge has been gained using simple 2D or more complex culture models, however these cultures have important limitations, such as a lack of perfusion and stretching and lack of cell-cell crosstalk. Organ-on-chip (OoC) technology may be used to overcome limitations of the in vitro models currently used in air pollution research and opens possibilities for studying the pathways underlying adverse health effects of air pollution on immune-mediated diseases of the lung and skin using more physiologically relevant exposure experiments. In this review we discuss currently used in vitro models to study the effect of air pollution on epithelial barrier integrity and development of immune-mediated diseases and identify gaps in current knowledge on adverse health effects of air pollution. We then focus on how OoC technology can enhance mechanistic studies of the skin and lung's response to air pollution.
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It is estimated that 99 % of the world population is exposed to air pollution above air quality guidelines and this is responsible for 6.7 million premature deaths annually. Lung and skin are the first organs exposed to air pollution, and this is associated with carcinogenesis, inflammation and atopic disease. Proposed mechanisms of adverse health effects in lung and skin include oxidative stress, inflammation, and loss of epithelial barrier integrity. Most knowledge has been gained using simple 2D or more complex culture models, however these cultures have important limitations, such as a lack of perfusion and stretching and lack of cell-cell crosstalk. Organ-on-chip (OoC) technology may be used to overcome limitations of the in vitro models currently used in air pollution research and opens possibilities for studying the pathways underlying adverse health effects of air pollution on immune-mediated diseases of the lung and skin using more physiologically relevant exposure experiments. In this review we discuss currently used in vitro models to study the effect of air pollution on epithelial barrier integrity and development of immune-mediated diseases and identify gaps in current knowledge on adverse health effects of air pollution. We then focus on how OoC technology can enhance mechanistic studies of the skin and lung's response to air pollution.
