Thinning of micromachined wafers for high-density, through-wafer interconnects

L Wang (TU Delft - Electronic Components, Technology and Materials)

C.C.G. Visser (TU Delft - Electronic Components, Technology and Materials)

CR de Boer (TU Delft - Electronic Components, Technology and Materials)

M Laros (TU Delft - Electronic Components, Technology and Materials)

W. van der Vlist (TU Delft - Electronic Components, Technology and Materials)

J. Groeneweg (TU Delft - Electronic Components, Technology and Materials)

G Craciun (TU Delft - Electronic Instrumentation)

P. M. Sarro (TU Delft - Electronic Components, Technology and Materials)