Thinning of micromachined wafers for high-density, through-wafer interconnects
Conference Paper
(2002)
Authors
L Wang (TU Delft - Electronic Components, Technology and Materials)
CCG Visser (TU Delft - Electronic Components, Technology and Materials)
Charles de Boer (TU Delft - Electronic Components, Technology and Materials)
M Laros (TU Delft - Electronic Components, Technology and Materials)
W. van der Vlist (TU Delft - Electronic Components, Technology and Materials)
J. Groeneweg (TU Delft - Electronic Components, Technology and Materials)
G Craciun (TU Delft - Electronic Instrumentation)
P. M. Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/19e322bc-4655-4b6e-8ef9-603e51608a90
More Info
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Publication Year
2002
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
121-126
ISBN (print)
90-73461-33-2
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