Development and usage of an etched transparent flowcell for visualisation of biofilm induced heterogeneities in porous media using particle image velocimetry

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Construction of glass micromodels with pore-size distributions in the 10-100 µm range using wet- and dry-etching techniques for the observation of counter-current imbibition

Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

A quantitative evaluation of pattern transfer across (111) surfaces in a (100) silicon wafer by contact masking and over-exposure

Titanium nitride for MEMS hotplates

Self-adjustment of optical interconnects using in-package MEMS-based actuators

Thinning of micromachined wafers for high-density, through-wafer interconnects

Fabrication of a glass-implemented microcapillary elettrophoresis device integrated contactless conductivity