Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

Conference paper (2007)

Authors

M Saadaoui Old - EWI Sect. ECTM
W.H.A. Wien Electronic Components, Technology and Materials - EEMCS
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
H. Schellevis Electronic Components, Technology and Materials - EEMCS
M Laros Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Old - EWI Sect. ECTM
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Published Date

2007

Language

Undefined/Unknown

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Research Group

Old - EWI Sect. ECTM