Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects
Conference Paper
(2007)
Author(s)
M Saadaoui (TU Delft - Old - EWI Sect. ECTM)
W.H.A. Wien (TU Delft - Electronic Components, Technology and Materials)
HW Van Zeijl (TU Delft - Electronic Components, Technology and Materials)
H Schellevis (TU Delft - Electronic Components, Technology and Materials)
M Laros (TU Delft - Electronic Components, Technology and Materials)
P. M. Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Old - EWI Sect. ECTM
To reference this document use:
https://resolver.tudelft.nl/uuid:8c5e2f99-4e7c-4f33-825b-2dafd63e0e4b
More Info
expand_more
expand_more
Publication Year
2007
Research Group
Old - EWI Sect. ECTM
Pages (from-to)
974-977
ISBN (print)
1-4244-1262-5
No files available
Metadata only record. There are no files for this record.