Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Conference paper (2008)

Authors

M Saadaoui Old - EWI Sect. ECTM
W.H.A. Wien Electronic Components, Technology and Materials - EEMCS
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
H. Schellevis Electronic Components, Technology and Materials - EEMCS
M Laros Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Old - EWI Sect. ECTM
More Info
expand_more

Published Date

2008

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Sect. ECTM