Wafer thinning for high-density, through-wafer interconnects

L Wang (TU Delft - Electronic Components, Technology and Materials)

CCG Visser (TU Delft - Electronic Components, Technology and Materials)

CR de Boer (TU Delft - Electronic Components, Technology and Materials)

J.M.W. Laros (TU Delft - Electronic Components, Technology and Materials)

W. van der Vlist (TU Delft - Electronic Components, Technology and Materials)

J Groeneweg (TU Delft - Electronic Components, Technology and Materials)

G Craciun (TU Delft - Electronic Instrumentation)

PM Sarro (TU Delft - Electronic Components, Technology and Materials)