A Data-Driven ANN-Based Model for FeCAP and FeFET
Orienting to SPICE and Circuit Design
Changhao Wang (Politecnico di Torino, University of Chinese Academy of Sciences, Institute of Microelectronics Chinese Academy of Sciences)
Sicong Yuan (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Nicolo Bellarmino (Politecnico di Torino)
Danyang Chen (Zhangjiang Laboratory)
Hanzhi Xun (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Lin Wang (Shanghai Jiao Tong University, TU Delft - Architecture and the Built Environment)
Mottaqiallah Taouil (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Moritz Fieback (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Said Hamdioui (TU Delft - Electrical Engineering, Mathematics and Computer Science)
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Abstract
Physics-based compact models for emerging non-volatile memories (NVMs) are often limited by the complex interactions of microscopic domains and defects that are difficult to capture analytically, resulting in reduced accuracy and simulation efficiency. To address this challenge, a machine learning (ML)-based approach is proposed using artificial neural networks (ANNs) trained entirely on device measurement data, enabling a direct translation of fabrication characteristics into SPICE-compatible circuit models. The resulting models achieve high accuracy (MSE: 0.724, adjusted R2 : 0.998), significantly outperforming physics-based baselines with an 18× lower MSE for polarization and a two-order-of-magnitude precision improvement in FeFET current simulation, while accurately capturing the wake-up process. Furthermore, the model demonstrates robust out-of-distribution (OOD) extrapolation to unseen ferroelectric thicknesses and a 33.7% improvement in simulation speed. These results validate the ML-based approach as a highly efficient, SPICE-compatible solution for next-generation memory.
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