Ultraviolet Sensing in WBG: SiC

Advances in delamination modeling of metal/polymer systems: Atomistic aspects

From Si Towards SiC Technology for Harsh Environment Sensing

Degradation and Failures of Polymers Used in Light-Emitting Diodes

Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

Outlook: From Physics of Failure to Physics of Degradation

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Reliability of LED-based Products is a Matter of Balancing Temperatures

Degradation of silicone-based sealing materials used in microelectronics

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

In-situ reliability monitoring of power packages using a Thermal Test Chip

Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Designing a 100 [aF/nm] capacitive transducer

Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects