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A. Ronchini Ximenes
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6 records found
1
Journal article
(2019)
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Augusto Ronchini Ximenes, Preethi Padmanabhan, Myung Jae Lee, Yuichiro Yamashita, Dun Nian Yaung, Edoardo Charbon
This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2 × (8 × 8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to-digital converter (TDC), 21-bit per-pixel memory, and in-locus data processing. Each module operates autonomously, by internal data acquisition, management, and storage, being periodically read out by an external access. The prototype was fabricated in a TSMC 3-D-stacked 45/65-nm CMOS technology, featuring backside illumination (BSI) SPAD detectors on the top tier, and readout circuit on the bottom tier. The sensor was characterized by single-point measurements, in two different modes of resolution and range. In low-resolution mode, a maximum of 300-m and 80-cm accuracy was recorded; on the other hand, in high-resolution mode, the maximum range and accuracy were 150 m and 7 cm, respectively. The module was also used in a flexible scanning light detection and ranging (LiDAR) system, where a 256 × 256 depth map, with millimeter precision, was obtained. A laser signature based on pulse-position modulation (PPM) is also proposed, achieving a maximum of 28-dB interference reduction.
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This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2 × (8 × 8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to-digital converter (TDC), 21-bit per-pixel memory, and in-locus data processing. Each module operates autonomously, by internal data acquisition, management, and storage, being periodically read out by an external access. The prototype was fabricated in a TSMC 3-D-stacked 45/65-nm CMOS technology, featuring backside illumination (BSI) SPAD detectors on the top tier, and readout circuit on the bottom tier. The sensor was characterized by single-point measurements, in two different modes of resolution and range. In low-resolution mode, a maximum of 300-m and 80-cm accuracy was recorded; on the other hand, in high-resolution mode, the maximum range and accuracy were 150 m and 7 cm, respectively. The module was also used in a flexible scanning light detection and ranging (LiDAR) system, where a 256 × 256 depth map, with millimeter precision, was obtained. A laser signature based on pulse-position modulation (PPM) is also proposed, achieving a maximum of 28-dB interference reduction.
Modular time-of-flight image sensor for light detection and ranging
A digital approach to LIDAR
Constant increase in data processing efficiency has enabled, among many other things, the intensive use of depth mapping technologies. Consumer applications, such as gaming, augmented and virtual realities (AR/VR), and other human-machine interfaces, are typically based on intensive image processing, either by triangulation and/or structured light, which has limitations on speed, resolution, range, and robustness to background noise. On the other hand, TOF depth sensing has been investigated in the academic and industrial engineering communities for several years, as an alternative to solve such restrictions, and few products are emerging. Direct time-of-flight (dTOF), specifically, requires more elaborate detectors and data processing, but it has the potential of reaching much longer distances at higher speed and accuracy, with the advantage of being robust to high background noise, making it suitable for space, automotive and consumer applications. One known drawback of dTOF, however, is data volume. For instance, automotive applications require over 100m range, only few centimeters accuracy, and multiple measurements for a reasonable precision, which produce data rates that can reach tens or even hundreds of Gbps, in large sensors, thus setting processing constraints to even very efficient GPUs, as well as chip readout capability. It is essential to provide as much on-chip processing as possible, in order to reduce data throughput, thus reducing power consumption and speeding up processing time. Some architectures have been proposed attempting to solve this problem, but the required memory renders them only feasible for an SiPM, single-pixel approach. Another known issue with light detection and ranging (LiDAR) is regarding the interference of multiple systems on each other. A software-based approach has been implemented, but requiring intensive post-processing resources. In this thesis, a novel approach for on-chip processing is proposed. With the use of cutting-edge 3D-stacking technologies, more flexibility and computational power can be spent on the chip, while not compromising fill factor. A novel proposal for dealing with external interferes is introduced, as well as novel phase/frequency locking solution at the sensor level, as a reference for timing measurements.
...
Constant increase in data processing efficiency has enabled, among many other things, the intensive use of depth mapping technologies. Consumer applications, such as gaming, augmented and virtual realities (AR/VR), and other human-machine interfaces, are typically based on intensive image processing, either by triangulation and/or structured light, which has limitations on speed, resolution, range, and robustness to background noise. On the other hand, TOF depth sensing has been investigated in the academic and industrial engineering communities for several years, as an alternative to solve such restrictions, and few products are emerging. Direct time-of-flight (dTOF), specifically, requires more elaborate detectors and data processing, but it has the potential of reaching much longer distances at higher speed and accuracy, with the advantage of being robust to high background noise, making it suitable for space, automotive and consumer applications. One known drawback of dTOF, however, is data volume. For instance, automotive applications require over 100m range, only few centimeters accuracy, and multiple measurements for a reasonable precision, which produce data rates that can reach tens or even hundreds of Gbps, in large sensors, thus setting processing constraints to even very efficient GPUs, as well as chip readout capability. It is essential to provide as much on-chip processing as possible, in order to reduce data throughput, thus reducing power consumption and speeding up processing time. Some architectures have been proposed attempting to solve this problem, but the required memory renders them only feasible for an SiPM, single-pixel approach. Another known issue with light detection and ranging (LiDAR) is regarding the interference of multiple systems on each other. A software-based approach has been implemented, but requiring intensive post-processing resources. In this thesis, a novel approach for on-chip processing is proposed. With the use of cutting-edge 3D-stacking technologies, more flexibility and computational power can be spent on the chip, while not compromising fill factor. A novel proposal for dealing with external interferes is introduced, as well as novel phase/frequency locking solution at the sensor level, as a reference for timing measurements.
Journal article
(2018)
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Myung Jae Lee, Augusto Ronchini Ximenes, Preethi Padmanabhan, Tzu Jui Wang, Kuo Chin Huang, Yuichiro Yamashita, Dun Nian Yaung, Edoardo Charbon
We present a high-performance back-illuminated three-dimensional stacked single-photon avalanche diode (SPAD), which is implemented in 45-nm CMOS technology for the first time. The SPAD is based on a P+/Deep N-well junction with a circular shape, for which N-well is intentionally excluded to achieve a wide depletion region, thus enabling lower tunneling noise and better timing jitter as well as a higher photon detection efficiency and a wider spectrum. In order to prevent premature edge breakdown, a P-type guard ring is formed at the edge of the junction, and it is optimized to achieve a wider photon-sensitive area. In addition, metal-1 is used as a light reflector to improve the detection efficiency further in backside illumination. With the optimized 3-D stacked 45-nm CMOS technology for back-illuminated image sensors, the proposed SPAD achieves a dark count rate of 55.4 cps/μm2 and a photon detection probability of 31.8% at 600 nm and over 5% in the 420-920 nm wavelength range. The jitter is 107.7 ps full width at half-maximum with negligible exponential diffusion tail at 2.5 V excess bias voltage at room temperature. To the best of our knowledge, these are the best results ever reported for any back-illuminated 3-D stacked SPAD technologies.
...
We present a high-performance back-illuminated three-dimensional stacked single-photon avalanche diode (SPAD), which is implemented in 45-nm CMOS technology for the first time. The SPAD is based on a P+/Deep N-well junction with a circular shape, for which N-well is intentionally excluded to achieve a wide depletion region, thus enabling lower tunneling noise and better timing jitter as well as a higher photon detection efficiency and a wider spectrum. In order to prevent premature edge breakdown, a P-type guard ring is formed at the edge of the junction, and it is optimized to achieve a wider photon-sensitive area. In addition, metal-1 is used as a light reflector to improve the detection efficiency further in backside illumination. With the optimized 3-D stacked 45-nm CMOS technology for back-illuminated image sensors, the proposed SPAD achieves a dark count rate of 55.4 cps/μm2 and a photon detection probability of 31.8% at 600 nm and over 5% in the 420-920 nm wavelength range. The jitter is 107.7 ps full width at half-maximum with negligible exponential diffusion tail at 2.5 V excess bias voltage at room temperature. To the best of our knowledge, these are the best results ever reported for any back-illuminated 3-D stacked SPAD technologies.
Direct time-of-flight (dTOF) image sensors require accurate and robust timing references for precise depth calculation. On-chip timing references are well-known and understood, but for imaging systems where several thousands of pixels require seamless references, area and power consumption limit the use of more traditional synthesizers, such as phase/delay-locked loops (PLLs/DLLs). Other methods, such as relative timing measurement (start/stop), require constant foreground calibration, which is not feasible for outdoor applications, where conditions of temperature, background illumination, etc. can change drastically and frequently. In this paper, a scalable reference generation and synchronization is provided, using minimum resources of area and power, while being robust to mismatches. The suitability of this approach is demonstrated through the design of an 8 × 8 time-to-digital converter (TDC) array, distributed over 1.69 mm2, fabricated using TSMC 65 nm technology (1.2 V core voltage and 4 metal layers—3 thin + 1 thick). Each TDC is based on a ring oscillator (RO) coupled to a ripple counter, occupying a very small area of 550 µm2, while consuming 500 µW of power, and has 2 µs range, 125 ps least significant bit (LSB), and 14-bit resolution. Phase and frequency locking among the ROs is achieved, while providing 18 dB phase noise improvement over an equivalent individual oscillator. The integrated root mean square (RMS) jitter is less than 9 ps, the instantaneous frequency variation is less than 0.11%, differential nonlinearity (DNL) is less than 2 LSB, and integral nonlinearity (INL) is less than 3 LSB.
...
Direct time-of-flight (dTOF) image sensors require accurate and robust timing references for precise depth calculation. On-chip timing references are well-known and understood, but for imaging systems where several thousands of pixels require seamless references, area and power consumption limit the use of more traditional synthesizers, such as phase/delay-locked loops (PLLs/DLLs). Other methods, such as relative timing measurement (start/stop), require constant foreground calibration, which is not feasible for outdoor applications, where conditions of temperature, background illumination, etc. can change drastically and frequently. In this paper, a scalable reference generation and synchronization is provided, using minimum resources of area and power, while being robust to mismatches. The suitability of this approach is demonstrated through the design of an 8 × 8 time-to-digital converter (TDC) array, distributed over 1.69 mm2, fabricated using TSMC 65 nm technology (1.2 V core voltage and 4 metal layers—3 thin + 1 thick). Each TDC is based on a ring oscillator (RO) coupled to a ripple counter, occupying a very small area of 550 µm2, while consuming 500 µW of power, and has 2 µs range, 125 ps least significant bit (LSB), and 14-bit resolution. Phase and frequency locking among the ROs is achieved, while providing 18 dB phase noise improvement over an equivalent individual oscillator. The integrated root mean square (RMS) jitter is less than 9 ps, the instantaneous frequency variation is less than 0.11%, differential nonlinearity (DNL) is less than 2 LSB, and integral nonlinearity (INL) is less than 3 LSB.
Journal article
(2017)
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Augusto Ronchini Ximenes, Gerasimos Vlachogiannakis, Robert Bogdan Staszewski
In this paper, we apply various area reduction techniques on an inductor–capacitor (LC)-tank oscillator in order to make its size comparable to that of ring oscillators (ROs), while still retaining its salient features of excellent phase noise and low sensitivity to supply variations. The resulting oscillator employs a proposed ultracompact split transformer topology that provides a 1:2 passive voltage gain and is less susceptible to common-mode electromagnetic interference than are regular high-quality-factor LC tanks, thus making it desirable in systemon-a-chip environments. The oscillator, together with a proposed dc-coupled buffer, is incorporated within an all-digital phaselocked loop (ADPLL) intended for wireline, digital clocking, and less stringent wireless systems. The ADPLL architecture introduces a look-ahead time-to-digital converter that exploits a deterministic phase prediction to reduce power consumption and phase detection complexity. The ADPLL is realized in 40-nm CMOS and has the smallest reported area of 0.0625 mm2 among LC-tank oscillators while providing fractional-N operation, wide tuning range of 45% (from 9.4 to 14.8 GHz), very low voltage supply sensitivity of 80 MHz/V, and integrated figure-of-merit jitter (FoMjitter) better than −230 dB. A separate identical ADPLL was implemented using an RO instead, for completeness and systematic comparisons.
...
In this paper, we apply various area reduction techniques on an inductor–capacitor (LC)-tank oscillator in order to make its size comparable to that of ring oscillators (ROs), while still retaining its salient features of excellent phase noise and low sensitivity to supply variations. The resulting oscillator employs a proposed ultracompact split transformer topology that provides a 1:2 passive voltage gain and is less susceptible to common-mode electromagnetic interference than are regular high-quality-factor LC tanks, thus making it desirable in systemon-a-chip environments. The oscillator, together with a proposed dc-coupled buffer, is incorporated within an all-digital phaselocked loop (ADPLL) intended for wireline, digital clocking, and less stringent wireless systems. The ADPLL architecture introduces a look-ahead time-to-digital converter that exploits a deterministic phase prediction to reduce power consumption and phase detection complexity. The ADPLL is realized in 40-nm CMOS and has the smallest reported area of 0.0625 mm2 among LC-tank oscillators while providing fractional-N operation, wide tuning range of 45% (from 9.4 to 14.8 GHz), very low voltage supply sensitivity of 80 MHz/V, and integrated figure-of-merit jitter (FoMjitter) better than −230 dB. A separate identical ADPLL was implemented using an RO instead, for completeness and systematic comparisons.
Conference paper
(2016)
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C.C. Li, T.H. Tsai, M Chen, A. Ronchini Ximenes, R. B. Staszewski, M.S. Yuan, C.C. Liao, C.H. Chang, T.C. Huang, H.Y. Liao, C.T. Lu, H.Y. Kuo, K. Hsieh
A tiny LC-tank-based ADPLL in 10nm FinFET CMOS achieves an area comparable to that of inverter-based ring-oscillator PLLs. A DCO occupying 0.016mm2 uses a controllable multi-turn magnetic coupling transformer to extend its tuning range to 10.8-19.3GHz (56.5%). A diversity of fine-tune capacitor banks limits the max/min step-size ratio to 2.3×. A new metastability-resolution scheme allows to use the frequency reference (FREF) clock directly instead of a retimed FREF (CKR) of conventional ADPLLs. A low-complexity estimator calculates inverse of the TDC. The fractional phase jitter (725fs) reaches sub-ps for the first time among PLLs of <;0.1mm2. Frequency pushing is 1.8%/V, which is at least 50× better than in traditional ring-type PLLs.
...
A tiny LC-tank-based ADPLL in 10nm FinFET CMOS achieves an area comparable to that of inverter-based ring-oscillator PLLs. A DCO occupying 0.016mm2 uses a controllable multi-turn magnetic coupling transformer to extend its tuning range to 10.8-19.3GHz (56.5%). A diversity of fine-tune capacitor banks limits the max/min step-size ratio to 2.3×. A new metastability-resolution scheme allows to use the frequency reference (FREF) clock directly instead of a retimed FREF (CKR) of conventional ADPLLs. A low-complexity estimator calculates inverse of the TDC. The fractional phase jitter (725fs) reaches sub-ps for the first time among PLLs of <;0.1mm2. Frequency pushing is 1.8%/V, which is at least 50× better than in traditional ring-type PLLs.