In-situ reliability monitoring of power packages using a Thermal Test Chip

Conference paper (2022)

Authors

H.A. Martin Electronic Components, Technology and Materials - EEMCS , Chip Integration Technology Center
R. Sattari Electronic Components, Technology and Materials - EEMCS
E.C.P. Smits Chip Integration Technology Center
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
W.D. van Driel Signify Research, Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2022 H.A. Martin, R. Sattari, E.C.P. Smits, H.W. van Zeijl, W.D. van Driel, Kouchi Zhang
DOI
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https://doi.org/10.1109/EuroSimE54907.2022.9758913
Reliability of power electronics In-situ analysis on reliability monitoring Transient thermal measurements Thermal Test Chips Thermal Compact Modelling Cauer electro-thermal model Von-Neumann stability criterion
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Published Date

2022

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during lifetime testing. A Thermal Test Chip (TTC) assembled into a Power Quad Flat No-lead (PQFN) package was employed as a test vehicle for non-destructive reliability assessment. The TTC comprises resistive heaters as a heat source and resistive temperature elements for measuring the thermal response. The transient thermal behavior was evaluated based on the contribution of heat source to a temperature field, and the temperature distribution was measured at multiple spatial positions. The experimental results provide insights into the thermal properties’ influence on the thermal behavior of the package. A compact electro-thermal model based on analogies was developed to deconvolute and analyze the transient thermal measurements. The results of the compact model correlate with the experimental measurements, and the model’s accuracy was verified using finite element simulations. The development of such thermal characterization experiments and computationally inexpensive models assist in further understanding the impact of failures in advancing high-power density electronics.