Manipulation, Sampling and Inactivation of the SARS-CoV-2 Virus Using Nonuniform Electric Fields on Micro-Fabricated Platforms: A Review

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Degradation of silicone-based sealing materials used in microelectronics

Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors

Design and Manufacturing of an In-Package Relative Humidity Sensor with Multi-Width Interdigital Electrodes Towards Enhanced Sensitivity for Characterization of Packaging Encapsulation Materials

Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Visible Blind Quadrant Sun Position Sensor in a Silicon Carbide Technology

Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology

In-situ reliability monitoring of power packages using a Thermal Test Chip

Patterning of fine-features in nanoporous films synthesized by spark ablation

Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology

Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip

In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics