Advances in materials science and memory devices work in tandem for the evolution of Artificial Intelligence systems. Energy-efficient computation is the ultimate goal of emerging memristor technology, in which the storage and computation can be done in the same memory crossbar. In this work, an analog memristor device is fabricated utilizing the unique characteristics of single-wall carbon nanotubes (SWCNTs) to act as the switching medium of the device. Via the planar structure, the memristor device exhibits analog switching ability with high state stability. The device’s conductance and capacitance can be tuned simultaneously, increasing the device's potential and broadening its applications' horizons. The multi-state storage capability and long-term memory are the key factors that make the device a promising candidate for bio-inspired computing applications. As a demonstrator, the fabricated memristor is deployed in spiking neural networks (SNN) to exploit its analog switching feature for energy-efficient classification operation. Results reveal that the computation-in-memory implementation performs Vector Matrix Multiplication with 95% inference accuracy and few femtojoules per spike energy efficiency. The memristor device presented in this work opens new insights towards utilizing the outstanding features of SWCNTs for efficient analog computation in deep learning systems.

Recently, phase change chalcogenides, such as monochalcogenides, are reported as switching materials for conduction-bridge-based memristors. However, the switching mechanism focused on the formation and rupture of an Ag filament during the SET and RESET, neglecting the contributions of the phase change phenomenon and the distribution and re-distribution of germanium vacancies defects. The different thicknesses of germanium telluride (GeTe)-based Ag/GeTe/Pt devices are investigated and the effectiveness of phase loops and defect loops future application in neuromorphic computing are explored. GeTe-based devices with thicknesses of 70, 100, and 200 nm, are fabricated and their electrical characteristics are investigated. Highly reproducible phase change and defect-based characteristics for a 100 nm-thick GeTe device are obtained. However, 70 and 200 nm-thick devices are unfavorable for the reliable memory characteristics. Upon further analysis of the Ag/GeTe/Pt device with 100 nm of GeTe, it is discovered that a state-of-the-art dependency of phase loops and defect loops exists on the starting and stopping voltage sweeps applied on the top Ag electrode. These findings allow for a deeper understanding of the switching mechanism of monochalcogenide-based conduction-bridge memristors.

Environmentally friendly humidity sensors with high sensing performance are considered crucial components for various wearable electronic devices. We developed a rapid-response and durable Paper Cellulose Fiber/Graphene Oxide Matrix (PCFGOM) humidity sensor using an all-carbon functional material. The fabricated sensor demonstrated a high sensitivity to humidity through an electrical impedance measurement, with an increase in response to humidity ranging from 10% to 90% at 1 kHz and 10 kHz, respectively, along with a response time of 1.2 s and a recovery time of 0.8 s. The stability of the sensor was also examined, with consistent performance over a period of 24 h. This novel sensor was employed in several applications, including non-contact proximity sensing, environmental humidity detection, and human respiration detection, to showcase its potential. Moreover, this work represents a significant milestone in developing inexpensive and eco-friendly humidity sensors, given the abundance of paper and graphene in nature and their biocompatibility.

This work presents a novel planar memimpedance device, named AMemImp, that consists of a Silver/reduced Graphene Oxide/Silver junction. AMemImp exhibits a unique ability for analog memimpedance tuning. For the first time in the literature, it is shown that the resistance and the capacitance of AMemImp device can be tuned simultaneously using a suitable voltage pulse. The oxide gap size (the distance between the metal electrodes) effect on both resistance and capacitance is also studied. It is proved that AMemImp capacitance follows semiconductors-based capacitance behavior during full ON state, while it has the insulator-based parallel plate capacitance characteristics during full OFF state. As a demonstrator, the analog capacitance switching behavior of AMemImp is utilized to build 2 capacitors and 2 transistors (2C2T) computation cell to perform multiply-and-accumulate operation. The non-volatile memcapacitor is exploited to store the data during the programming mode and perform multiplication in the computation mode. The 2C2T is used in a 5x4 crossbar where 20 operations are achieved in a single clock cycle with an error of 5.7%. AMemImp is considered great merit for tunable memory, computing, and RF systems.

Recently, Memristor (MR) device has received much attention in many applications, including memory, computing, neuromorphic, sensing, and security. Electrical characterization and testing of MR are among the main challenges facing MR technology. Available MR characterization tools are costly and bulky, limiting the research contributions in this field to big institutions. Furthermore, there is a need for a portable testing platform that provides the means to extract MR parameters, mainly when used in sensing or security applications. This work proposes a novel power-efficient, cost-effective, lightweight, and automated Arduino-based MR characterization platform named MemChar. A detailed circuit and system implementation of MemChar are presented. MemChar functionality results are compared to industry-standard device parameter analyzer tools, i.e., Keithley 4200A, with excellent correlation. MemChar is an easy-to-implement and user-friendly platform that provides a significant milestone toward utilizing MR devices in mobile, IoT, and sensing applications.

Tunable electronics are of great potential for intelligent, adaptable systems. Memristors and memcapacitors have been extensively investigated recently as low power, high density, and high-speed elements to provide tunable-state needed by many emerging applications. Examples of such systems are tunable filters, tunable antennas, multi-level memory, and computing components. This work reports on a novel tunable analog memimpedance device. For the first time, it is proved that analog change in both resistance and capacitance can be achieved simultaneously in the same metal–semiconductor-metal structure. The novel planar geometry device consists of silver-reduced graphene oxide-silver. The multistate memimpedance behavior is observed and investigated for different oxide widths and the results confirmed the scaling of the device capacitance accordingly. Detailed study based on experimental findings shows that the capacitance of the novel system presented in this work follows n-type MOS capacitance behavior. The device is fabricated on a flexible substrate which extends its value to be deployable in smart wearable devices, in addition to its compatibility with CMOS Technology.

This study presents a novel hybrid memristor (MR)-complementary metal-oxide-semiconductor-based flash analogue-to-digital converter (ADC). The speed and efficiency of the ADC are important aspects that can significantly affect the overall system performance. The flash ADC is considered the fastest type of ADCs; however, its performance is affected by the resistor mismatch. The proposed flash ADC is the first to use tunable MR to replace conventional resistor to generate accurate reference voltages. This is achieved by utilising the highly analogue behaviour observed in multi-state MR devices fabricated and tested by the authors' group. The electrical parameters of the devices have been extracted by device characterisation, then the voltage-threshold adaptive model (VTEAM) has been used to develop a correlated mathematical and Simulation Program with Integrated Circuit Emphasis (SPICE) device model. The proposed MR-based flash-ADC design solves the issue of resistor mismatch that results in encoding errors by the ability to tune the MR resistance value post-processing. Moreover, being a nanoscale component, the usage of MR significantly improves the area efficiency of the target ADC. Furthermore, the proposed design has improved the ADC transfer function characteristic and has lower differential non-linearity and integral non-linearity errors compared with the conventional design.

This chapter presents a physics-based mathematical model for anionic memristor devices. The model utilizes Poisson Boltzmann equation to account for temperature effect on device potential at equilibrium and comprehends material effect on device behaviors. A detailed MATLAB-based algorithm is developed to clarify and simplify the simulation environment. Moreover, the provided model is used to simulate and predict the effect of oxide thickness, material type, and operating temperatures on the electrical characteristics of the device. The value of this contribution is to provide a framework intended to simulate anionic memristor devices using correlated mathematical models. In addition, the model can be used to explore device materials and predict its performance.

The first physical demonstration of a non-volatile resistive-switching memory based on the nanostructured Pt/TiO₂/Pt metal/insulator/metal stack from HP, has spurred the scientific community to develop memristive devices for a wide variety of applications. Owing to low-power and ultra-fast switching capabilities, memristors with nanoscale thickness geometry have been extensively investigated as potential replacements for flash memory technology in simple analog- and digital- computing applications. In Addition, both scalability and interconnectivity of memristors, through brain-inspired computing, have sparked a considerable move toward advancing of next-generation intelligent computing systems. On the horizon, other potential uses of the memristor have also emerged, particularly in sensing where attractive measurable changes in the I–V fingerprint of some device configurations have been demonstrated under certain types of extrinsic disturbances. Additionally, the unique and chaotic I–V response of some memristors opens the door for potential applications in hardware security. This chapter reports on novel approaches to utilize the electrical characteristics of the fabricated memristive devices for radiation sensing and security applications.

Bio-inspired semiconductor-based devices with adaptive and dynamic properties will have many advantages over conventional static digital silicon-based technologies. The ability to compute, process, and retain information in parallel, without referencing other circuit elements, offers enhanced speed, storage density, energy efficiency, and functionality benefits. A novel crossbar microwire-based device consisting of Nb/NbO/Pt structure that exhibits neural synapse-like adaptive conductivity (i.e., synaptic plasticity) is presented. The neuromorphic memristive junction, formed at the interface between the Pt metal wire and the thermally annealed core-shell Nb–NbO wire, demonstrates 1000 times conductivity change with an effective continuum of resistance levels. The device can also be fully activated to display standard resistance switching between two states. In the subthreshold regime, the voltage flux applied through the ~400 nm thick NbO junction is shown to have a linear relationship to the charge produced within the device. The conductance value G is a function of the total flux history applied. This has implications in emerging neuromorphic semiconductor hardware.

In this chapter, the geometric scaling effect is investigated on the unipolar switching behavior of nano-thick Pd(TE)/Hf (capping)/HfO₂/Pd(BE) metal-insulator-metal memristive devices. The electrical I–V characteristics of such device are studied as a function of the active area and thickness of each of the metal-oxide film and the capping layer. The device active area is shown to play a critical role in dictating the magnitude of the threshold turn-on voltage (V _ON). For (Hf-7 nm/HfO₂-10 nm) stack particularly, it is found that the average V _ON decreases from 4.7 to 2.8 V when the active area increases from 50 × 50 to 200 × 200 µm². Beyond this size, the threshold V _ON saturates and the device active area have a minimal effect on V _ON. Also, the switching ON voltage increases when the capping layer thickness increases as it adds to the total active film of the device. For the fabricated devices, decreasing the oxide thickness from 10-nm to 5-nm reduces the average turn-on voltage by 21-to-27% for 50 × 50-to-400 × 400 µm² active area range, demonstrating an improvement in the threshold power consumption of the memristor. These findings can be used to guide the design and fabrication of memristors for an improved RRAM and memristive-based applications.

Memristors are one of the emerging technologies that can potentially replace state-of-the-art integrated electronic devices for advanced computing and digital and analog circuit applications including neuromorphic networks. Over the past few years, research and development mostly focused on revolutionizing the metal-oxide materials, which are used as core components of the popular metal-insulator-metal (MIM) memristors owing to their highly recognized resistive switching behavior. This chapter outlines the recent advancements and characteristics of such memristive devices, with a special focus on (i) their established resistive switching mechanisms and (ii) the key challenges associated with their fabrication processes including the impeding criteria of material adaptation for the electrode, capping, and insulator component layers. Potential applications and an outlook into the future development of metal-oxide memristive devices are also outlined.

In this paper, we investigate the switching behavior of nano-thick microscale Pd/Hf/HfO₂-10 nm/Pd memristors. Several key electrical characteristics such as the forming voltage and the SET/RESET I[sbnd]V parameters are studied as a function of the device size, the hafnium-capping thickness and the environmental temperature. The fabricated stack exhibits a unipolar switching behavior that is characteristic of two interfacial oxide and buffer layers consisting of the same transition metal. The average forming voltage value decreases oppositely to the microscale device area while it increases with the Hf-capping layer thickness. The unipolar memristive switching behavior is found to be polarity-dependent due to diverse contributions of the top Hf-buffer layer and the bottom Pd electrode to the switching mechanism. Joule heating effects involving thermophoresis and diffusion are concluded to be predominantly governing the ON/OFF switching events in the positive polarity. Synergistic electric field effects are found to additionally control the unipolar switching behavior in the negative mode. The respective key roles of the top Hf-buffer layer and the bottom Pd electrode in the asymmetric unipolar memristive switching are elucidated at the molecular level according to well-established transport phenomena reported for oxygen vacancies. Given the importance of heat in controlling the conductance state of the proposed stack, the memristor's electrical sensitivity to changes in the ambient temperature is preliminarily investigated for potential temperature sensing applications.