Domonkos Horváth
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On the longevity and inherent hermeticity of silicon-ICs: evaluation of bare-die and PDMS-coated ICs after accelerated aging and implantation studies (Nature Communications, (2025), 16, 1, (12), 10.1038/s41467-024-55298-4)
Correction to: Nature Communicationshttps://doi.org/10.1038/s41467-024-55298-4, published online 02 January 2025 In this article the following sentence was omitted from the acknowledgements section, ‘This research was funded by the following projects: Project CANDO (Controlling Network Dynamics with Optogenetics), funded by UK EPSRC (grant ref: NS/A000026/1) and the Wellcome Trust (contract ref: 102037/Z/13/Z)’. The original article has been corrected.
On the longevity and inherent hermeticity of silicon-ICs
Evaluation of bare-die and PDMS-coated ICs after accelerated aging and implantation studies
Miniaturization of next-generation active neural implants requires novel micro-packaging solutions that can maintain their long-term coating performance in the body. This work presents two thin-film coatings and evaluates their biostability and in vivo performance over a 7-month animal study. To evaluate the coatings on representative surfaces, two silicon microchips with different surface microtopography are used. Microchips are coated with either a ≈100 nm thick inorganic hafnium-based multilayer deposited via atomic layer deposition (ALD-ML), or a ≈6 µm thick hybrid organic–inorganic Parylene C and titanium-based ALD multilayer stack (ParC-ALD-ML). After 7 months of direct exposure to the body environment, the multilayer coatings are evaluated using optical and cross-sectional scanning electron microscopy. Time-of-flight secondary ion mass spectrometry (ToF-SIMS) is also used to evaluate the chemical stability and barrier performance of the layers after long-term exposure to body media. Results showed the excellent biostability of the 100 nm ALD-ML coating with no ionic penetration within the layer. For the ParC-ALD-ML, concurrent surface degradation and ion ingress are detected within the top ≈70 nm of the outer Parylene C layer. The results and evaluation techniques presented here can enable future material selection, packaging, and analysis, enhancing the functional stability of future chip-embedded neural implants.