A highly miniaturized, single-chip, large scanning range MOEMS scanner is demonstrated. This intrinsically-aligned, monolithically integrated device uses small angular displacement to provide a linear scanning range of 2000 μm in the lateral and 1000 μm in the vertical direction, at a working distance of 2 cm, with an average operating power lower than 170 mW. Within a footprint of only 7×10 mm², the presented system fully integrates a photonic interferometer comprising a mirror, a silicon microlens and the MEMS actuator into a single chip, thus offering an unprecedentedly miniaturized scanning solution. The monolithic integration of all photonic components provides intrinsic alignment and excludes coupling losses often encountered in systems composed of discrete parts. No additional attenuation of the optical signal is observed during device operation. This small and high-performance device is suitable as complete system-on-chip for commercial, portable imaging applications.

The high aspect ratio and the porous nature of spatially oriented forest-like carbon nanotube (CNT) structures represent a unique opportunity to engineer a novel class of nanoscale assemblies. By combining CNTs and conformal coatings, a 3D lightweight scaffold with tailored behavior can be achieved. The effect of nanoscale coatings, aluminum oxide (Al₂O₃) and nonstoichiometric amorphous silicon carbide (a-SiC), on the thermal transport efficiency of high aspect ratio vertically aligned CNTs, is reported herein. The thermal performance of the CNT-based nanostructure strongly depends on the achieved porosity, the coating material and its infiltration within the nanotube network. An unprecedented enhancement in terms of effective thermal conductivity in a-SiC coated CNTs has been obtained: 181% compared to the as-grown CNTs and Al₂O₃ coated CNTs. Furthermore, the integration of coated high aspect ratio CNTs in an epoxy molding compound demonstrates that, next to the required thermal conductivity, the mechanical compliance for thermal interface applications can also be achieved through coating infiltration into foam-like CNT forests.

In this paper, we present an electrothermal biaxial MEMS actuator system, which provides x-A nd y-direction scanning for a fully integrated 3-D optical coherence tomography (OCT) scanner. An angular scanning range of 8° (corresponding to a 7-mm linear scanning range in both directions) is achieved, with an average power consumption of 150 mW. The resonant frequency is 668 and 297 Hz for x-A nd y-directions, respectively. With a footprint of only 2.5×2.5mm², this system is part of a device which also integrates an optical waveguide and a collimated lens on the same chip, thus making the fully integrated, self-aligned, and miniaturized 3-D OCT scanners feasible.

Two novel MEMS actuator systems (a torsional one and a deflecting one) for a new self-aligned integrated 3D optical coherent tomography (OCT) scanner are reported. These new systems, with a footprint of 2.5mm×2.5 mm each, provide a χ and y scanning range of 730 μm (tilting range of 8°) with an average power consumption of 150 mW. As the device integrates a silicon collimating micro lens, an optical waveguide and a MEMS actuator system on a single chip, it provides a considerable decrease in optical losses thanks to the intrinsic alignment obtained during fabrication, while significantly reducing the complexity and time that assembly and packaging of separate components demand, therefore making fully integrated, miniaturized 3D OCT scanners feasible.

We present Si microlenses fabricated using dry ICP plasma etching of silicon and thermal photoresist reflow. The process is insensitive to thermal reflow time and it can be easily incorporated into fabrication flows for complex optical systems. Using this process, we were able to fabricate microlenses with diameter of 150 μm, radius of curvature of 682 μm and with a surface roughness of only 25 nm.