IM
I Maus
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1 records found
1
Conference paper
(2017)
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I. Maus, C. Liebl, M. Fink, Duc-Khoi Vu, M. Hartung, H. Preu, Kaspar Jansen, B. Michel, B Wunderle, Laurens Weiss
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.
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In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.