FL

Feng Li

19 records found

Authored

The development of direct probes of entanglement is integral to the rapidly expanding field of complex quantum materials. Here we test the robustness of entangled neutrons as a quantum probe by measuring the Clauser-Horne-Shimony-Holt contextuality witness while varying the be ...

This paper focuses on a new non-ideal phenomenon induced by the power supply crosstalk (PSC) of the row drive circuit in 8 T global shutter (GS) CMOS image sensors (CISs). A method to eliminate the non-ideal phenomenon is presented. Based on the circuit simulation, the relatio ...

Stöber silica particles are used in a diverse range of applications. Despite their widespread industrial and scientific uses, information on the internal structure of the particles is non-trivial to obtain and is not often reported. In this work we have used spin-echo small angle ...
Pattern shift is one of the main failures of micro-electronics. In this paper, the influence of plastic deformation values of micro-structures of IC packages on the pattern shift of metal lines is studied by maximum plastic strain theory using a certain 2D FEM model with differen ...
The passivation cracking of Micro-structures of IC packages is studied by maximum principal stress theory using a certain 2D FEM model with different design parameters, pitch of lines, width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue m ...
Passivation cracking is one of the main failures of Integrated Circuits (ICs) and thermo-mechanical failures are the root cause. A major cause for these failures is due to the mismatch of thermal and mechanical parameters while manufacturing or working, especially stress concentr ...