One of the main bottlenecks in the pursuit of a large-scale-chip-based quantum computer is the large number of control signals needed to operate qubit systems. As system sizes scale up, the number of terminals required to connect to off-chip control electronics quickly becomes unmanageable. Here, we discuss a quantum-dot spin-qubit architecture that integrates on-chip control electronics, allowing for a significant reduction in the number of signal connections at the chip boundary. By arranging the qubits in a two-dimensional array with about 12μm pitch, we create space to implement locally integrated sample-and-hold circuits. This allows us to offset the inhomogeneities in the potential landscape across the array and to globally share the majority of the control signals for qubit operations. We make use of advanced circuit modeling software to go beyond conceptual drawings of the component layout, to assess the feasibility of the scheme through a concrete floor plan, including estimates of footprints for quantum and classical electronics, as well as routing of signal lines across the chip using different interconnect layers. We make use of local demultiplexing circuits to achieve an efficient signal-connection scaling, leading to a Rent's exponent as low as p=0.43. Furthermore, we use available data from state-of-the-art spin qubit and microelectronics technology development, as well as circuit models and simulations, to estimate the operation frequencies and power consumption of a million-qubit array. This work presents a complementary approach to previously proposed architectures, focusing on a feasible scheme to integrating quantum and classical hardware, and identifying remaining challenges for achieving full fault-tolerant quantum computation. It thereby significantly closes the gap towards a fully CMOS-compatible quantum computer implementation.

3D integration has well-developed for traditional CMOS technology operating at room temperature, but few studies have been performed for cryogenic applications such as quantum computers. In this paper, a wafer-to-wafer bonding of superconductive joints based on niobium nitride (NbN) is performed to demonstrate the possibility of 3D integration of superconducting chips. The NbN thin films are deposited by magnetron sputtering. Its high critical temperature (15.2 K) is achieved by optimizing the sputtering recipe in terms of N₂ flow rate and discharge voltage. Wafer-level bumping is bonded by the thermo-compression method. The sheet resistance of the thin film and the contact resistance of the joints are measured by the Greek-cross (4-point Kelvin method) and daisy chain structures at cryogenic temperature, respectively. Direct-bonding wafers with NbN superconductive joints avoid using adhesive layers and the bonding interface could still present superconducting electrical connections in a cryogenic environment above 4 K, which will allow us to use a smaller and high-cooling power cryostat. The contribution of this work could lead to the fabrication of multi-layered superconducting chip that operates beneficially in cryogenic temperature, which is essential in building scalable quantum processors.