6 records found
1
Characteizatin of deposition rate and gap filling capability of a high density plasma deposition reactor
SiOFx and SiO2 deposition in an ECR-HDP reactor: Tool characterisation and film analysis
Stress in AlNiCr films and stacks of films
Trenchfill with SiOF, uniformity of properties of interest over the wafer
Trenchfill with SiOF, electrical results
Baseline of the High Density Plasma Deposition tool asessed in SiO2 deposition