8 records found
1
Warpage minimization of the HVQFN map mould
Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound
Analysis of Cu/low-k bond pad delamination by using a novel failure index
Driving mechanisms of delamination related reliability problems inexposed pad packages
Viscoelastic characterization of fast curing moulding compounds
On wire failures in micro-electronic packages
Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques
Virtual qualification of moisture induced failures of advanced packages