Deformation Mechanism in the Forcefill Process.

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Mechanism for forcefill.

Kinetcs of copper forcefill.

Influence of SiH2Cl2 on the kinetics of chemical vapor deposition of tungsten by SiH4 reduction of WF6.

High Pressure Filling of Sub-micron Aluminium Vias

Aluminium via fill at elevated pressure and teperature

Report of cleaning of the water after contact to the pressurizing medium and Report on the integrity of reviously defined circuits to the prevalent temperature and pressure in liquid mediated forcefill

The role of the TiN liner in forcefill.

Kinetics of Copper Forcefill.

Report on kinetics of forcefill and relation between in-plane stress and forcefill capability

High Pressure Aluminium for Submicron Vias using a Liquid Transducer

Stress in AlNiCr films and stacks of films

High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

Report on stress relaxation at constant temperatures in AlNiCr contiguous films and stacks of films

Reactive Ion Etchin of metal stack consisting of an aluminium ally, WGe barrier and Ti adhesion layer

Mechanical Reliability of CVD-Copper Thin Films

Isothermal stress relaxation in Al, AlCu and AlVPd films

Evaluation of electrical properties of CVD-WGex barriers fabricated by the reduction of WF6 and GeH4

Report on etching of a stack consisting of an aluminum alloy, WGe barrier and Ti adhesion layer. Anisotropy, selectivity to oxide and quality of the adhesion.