Mechanical and structural properties of aluminium alloy thin films for microelectronic applications

Phase transformations in Al-Cu thin films: Precipitation and copper redistribution.

Influence of the passivation material on Stress voiding in AI-Cu alloys.

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Characterization of precipitation in Al-Cu thin films by DSC and X-ray diffraction analysis.

In-situ characterization of precipation in Al-Cu thin films.

Cu concentration dependence of the mechanical behaviour of Al-Cu alloys.

High Pressure Filling of Sub-micron Aluminium Vias

Aluminium via fill at elevated pressure and teperature

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Stress voiding in passivated Al-Cu alloys

Mechanical behaviour during thermal cycling of AIVPd line patterns

High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

Mechanical Reliability of CVD-Copper Thin Films

High Pressure Aluminium for Submicron Vias using a Liquid Transducer

Report on mechanical and electrical reliability of AlNiCr

Stress in AlNiCr films and stacks of films

Report on stress relaxation at constant temperatures in AlNiCr contiguous films and stacks of films

Report on electromigration- and stress migration properties of AlSi VPd alloys

Copper for IC-applications. Mechanical reliability of CVD copper films