3-D silicon carbide surface micromachined accelerometer compatible with CMOS processing

3D SiC CMOS compatible surface micromachined accelerometer

Fabrication of a SOG-MEMS vibratory gyroscope by deep RIE technology and bonding (U_SP_2_I_IC_T)

SOG fabrication of bulk micromachined and bonded capacitive inertial sensor structures (U_SP_2_I_IC_T)

Low Voltage, High Speed RF-Switch with High On-Off Capacitance Ratio (U-SP-2-I-ICT)

Low voltage, high speed RF switch with high switching capacitance ratio (U-SP-2-I-ICT)

Low voltage high speed rf switch

CMOS compatible pressure sensors: a comparison between SiC and SiN

Single step IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Surface micromachined CMOS compatible vertical accelerometer

A novel ull-in accelerometer

Fabrication of a CMOS compatible pressure sensor for harsh environments

Electromechanical optical attenuation in micromachined SiC waveguids

A novel RF switch with low driving voltage

Fabrication of a CMOS compatibile pressure sensor for harsh environments

IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

A novel pull-in accelerometer

Modified Reynold's equation and analytical analysis of squeeze-film air damping of perforated structures

Fabrication of a CMOS compatible vertical accelerometer

Design of a novel electrostatic switch with low operating voltage and high speed